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Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair
Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair
Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair
Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair
Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair
Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair

Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair

SKU: AC-7RO2J6LJPQY

Price

€46.79

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MSRP:€52.79
11%
discount

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0.2mm

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  • Free shipping
  • 100 days returns
  • Low prices

Lead Free 250K Bga Reballing Ball 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm Solder Ball for Chip BGA Rework Repair

Specifications:

  • Model Number: Lead Free Qwin Bga Reballing Ball
  • Particle Size: 1-10μm
  • Quantities: Lead Free 250K







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