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1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools

1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools

SKU: AC-LMO0V7ZVZM7

Price

€67.49

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MSRP:€90.39
25%
discount

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10in 1 Full Set

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1 Bottles BGA Reballing Balls ( 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools

Specifications:

  • Application: It is used instead of the pin in the IC component package structure.
  • Certification: CE
  • Diameter: 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65
  • Flux Content: Balls Alloy: Sn63/Pb37
  • Material: Balls Alloy
  • Melting Point: 10-25μm
  • Model Number: bst
  • Origin: CN(Origin)
  • Weight: Bottle







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